Assignment of Assignor's Interest

Recorded: 2010-12-22 Pages: 5

Assignors

CHEN, WEI-MING

Executed: 2010-11-25

CHANG, SHU-MING

Executed: 2010-10-06

Assignee

XINTEC INC.

9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, TAOYUAN COUNTY, JHONGLI CITY, 32062, TAIWAN

Covered Property (1)

Chip Package and Fabrication Method Thereof

Patent: 8,227,927 →

Application: 12/900,190 →

Publication: US 2011/0084382