IP Library Assignment 025541/0224
Patent Assignment
Reel/Frame 025541/0224

Assignment of Assignor's Interest

Recorded: 2010-12-28 Pages: 3
Assignor
GUZEK, JOHN
Executed: 2010-03-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Recessed and Embedded Die Coreless Package
Patent: 8,742,561 →
Application: 12/655,321 →
Publication: US 2011/0156231
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →