Assignment of Assignor's Interest

Recorded: 2010-12-21 Pages: 2

Assignors

NANKAWA, HANAKO

Executed: 2010-09-22

MIYASAKA, MASAHIRO

Executed: 2010-09-22

MURAMATSU, YUKIKO

Executed: 2010-09-22

Assignee

HITACHI CHEMICAL COMPANY, LTD.

1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KUT, TOKYO, 163-0449, JAPAN

Covered Property (1)

Photosensitive Resin Composition, Photosensitive Element, Method of Forming Resist Pattern, and Process for Producing Printed Wiring Board

Patent: 8,586,284 →

Application: 12/933,728 →

Publication: US 2011/0086309

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.