Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

1. A photosensitive resin composition comprising:

(A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group represented by the following formula (I), 5-55 parts by weight of a divalent group represented by the following formula (II) and 15-50 parts by weight of a divalent group represented by the following formula (III);

(B) a photopolymerizing compound;

(C) a photopolymerization initiator; and

(D) at least one sensitizing dye with a maximum absorption wavelength of 370-420 nm selected from the group consisting of pyrazolines, anthracenes, coumarins, xanthones, triazoles, triazines, thiophenes and naphthalimides,

wherein, in formula (I), formula (II) and formula (III), R 1 , R 3 and R 5 each independently represent hydrogen or a methyl group, R 2 represents C1-3 alkyl, C1-3 alkoxy, hydroxyl, amino or a halogen atom, R 4 represents an optionally substituted alicyclic hydrocarbon, optionally substituted aromatic hydrocarbon or optionally substituted heterocyclic group, m represents an integer of 0-5, and when m is 2-5, the multiple R 2 groups may be the same or different.

2. The photosensitive resin composition according to claim 1 , wherein R 4 is a monovalent group represented by the following formula (IV),

wherein, in formula (IV), R 6 represents hydroxyl, C1-12 alkyl or C1-12 hydroxyalkyl, n represents an integer of 0-5, and when n is 2-5 the multiple R 6 groups may be the same or different.

3. The photosensitive resin composition according to claim 1 , wherein R 4 is at least one group selected from the group consisting of monovalent groups represented by the following formulas (V), (VI), (VII) and (VIII),

wherein, in formulas (V), (VI), (VII) and (VIII), R 7 , R 8 and R 9 each independently represent hydroxyl, C1-12 alkyl or C1-12 hydroxyalkyl, j represents an integer of 0-4, k and p represent integers of 0-9, and when j, k or p is 2 or greater, the multiple R 7 , R 8 or R 9 groups may be the same or different.

4. The photosensitive resin composition according to claim 1 , wherein the (C) photopolymerization initiator comprises a hexaarylbiimidazole derivative.

5. The photosensitive resin composition according to claim 1 , further comprising (E) an amine-based compound.

6. A photosensitive element comprising:

(a) a support film; and

(b) a photosensitive resin composition layer containing the photosensitive resin composition according to claim 1 , wherein the photosensitive resin composition layer is formed on the support film.

7. A method of forming a resist pattern, the method comprising the steps of:

(a) laminating a photosensitive resin composition layer containing the photosensitive resin composition according to claim 1 on a circuit-forming board;

(b) exposing at least one prescribed section of the photosensitive resin composition layer to irradiation with active light rays, wherein exposure to irradiation photocures the at least one exposed prescribed section; and

(c) removing at least one unexposed section of the photosensitive resin composition layer from the circuit-forming board on which the photosensitive resin composition layer has been laminated.

8. A method of producing a printed wiring board, the method comprising the steps of:

(a) providing a circuit-forming board having a resist pattern formed by the method of claim 7 ;

(b) etching or plating the circuit-forming board, wherein the etching or plating forms a conductor pattern.