Patent Assignment
Reel/Frame 025548/0540
Assignment of Assignor's Interest
Recorded: 2010-12-21
Pages: 4
Assignors
SONE, TADAKAZU
Executed: 2010-12-13
MOTOSHIMA, YASUYUKI
Executed: 2010-12-13
MARUYAMA, TORU
Executed: 2010-12-13
ONO, KATSUTOSHI
Executed: 2010-12-13
SHIOKAWA, YOICHI
Executed: 2010-12-13
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU,, TOKYO, JAPAN
Covered Property
(1)
Substrate Polishing Apparatus, Substrate Polishing Method, and Apparatus for Regulating Temperature of Polishing Surface of Polishing Pad Used in Polishing Apparatus