Patent Assignment
Reel/Frame 025555/0286
Assignment of Assignor's Interest
Recorded: 2010-12-29
Pages: 6
Assignors
ANKIREDDI, SESHASAYEE
Executed: 2010-12-15
GEKTIN, VADIM
Executed: 2010-12-07
JONES, JAMES A.
Executed: 2010-12-16
STERN, MARGARET B.
Executed: 2010-12-09
Assignee
ORACLE AMERCIA, INC.
500 ORACLE PARKWAY, REDWOOD CITY, CALIFORNIA, 94065
Covered Property
(1)
Metallic Thermal Joint for High Power Density Chips