IP Library Assignment 025559/0495
Patent Assignment
Reel/Frame 025559/0495

Assignment of Assignor's Interest

Recorded: 2010-12-30 Pages: 2
Assignors
AOYAGI, NOBUYUKI
Executed: 2010-12-20
SEYAMA, KOHEI
Executed: 2010-12-20
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 211-8588, JAPAN
Covered Property (1)
Bonding Apparatus
Patent: 8,800,843 →
Application: 12/982,019 →
Publication: US 2011/0155789
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →