IP Library Assignment 025560/0559
Patent Assignment
Reel/Frame 025560/0559

Assignment of Assignor's Interest

Recorded: 2010-12-22 Pages: 2
Assignors
LIN, CHARLES W.C.
Executed: 2010-12-21
WANG, CHIA-CHUNG
Executed: 2010-12-21
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT, TAIPEI, 112, TAIWAN
Covered Property (1)
Semiconductor Chip Assembly with Post/Base Heat Spreader with Esd Protection Layer
Patent: 8,310,043 →
Application: 12/975,429 →
Publication: US 2011/0089465