Patent Assignment
Reel/Frame 025564/0481
Assignment of Assignor's Interest
Recorded: 2010-12-23
Pages: 3
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Method for Producing Vias in Fan-Out Wafers Using Dry Film and Conductive Paste, and a Corresponding Semiconductor Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.