Patent Assignment
Reel/Frame 068433/0985
Assignment of Assignor's Interest
Recorded: 2024-07-18
Pages: 9
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2024-06-28
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties
(59)
Manufacturing Fan-Out Wafer Level Packaging
Semiconductor Package with a Stiffening Member Supporting a Thermal Heat Spreader
Device and Method for Testing Magnetic Switches at Wafer-Level Stage of Manufacture
Thermally Enhanced Expanded Wafer Level Package Ball Grid Array Structure and Method of Making the Same
Self Repairing Ic Package Design
Multi-Stacked Semiconductor Dice Scale Package Structure and Method of Manufacturing Same
Fan-Out Wafer Level Package with Polymeric Layer for High Reliability
Fan-Out Wafer Level Package for an Optical Sensor and Method of Manufacture Thereof
Switch with Increased Magnetic Sensitivity
Multi-Layer via-Less Thin Film Resistor
Via-Less Thin Film Resistor with a Dielectric Cap
Method and System for Shielding Semiconductor Devices from Light
Wafer-Level Packaging Method Using Composite Material as a Base
Shielding Techniques for an Integrated Circuit
A Camera Module Including an Image Sensor and a Laterally Adjacent Surface Mount Device Coupled at a Lower Surface of a Dielectric Material Layer
Thermoelectric Cooler System, Method and Device
Thermoelectric Cooler System, Method and Device
Method for Producing Vias in Fan-Out Wafers Using Dry Film and Conductive Paste, and a Corresponding Semiconductor Package
Lens Alignment Apparatus and Method
Thin Film Metal-Dielectric-Metal Transistor
Thermo Programmable Resistor Based Rom
Through Hole via Filling Using Electroless Plating
Reconstituted Wafer Warpage Adjustment
Semiconductor Package and Method of Manufacturing the Same
Image Sensor Circuit, System, and Method
Through Hole via Filling Using Electroless Plating
Microsensor with Integrated Temperature Control
Semiconductor Package with Improved Pillar Bump Process and Structure
Gettering Method for Dielectrically Isolated Devices
ALCu HARD MASK PROCESS
System and Method for Security Using a Sibling Smart Card
Chemical Sensor with Replaceable Sample Collection Chip
Single Chip Having the Chemical Sensor and Electronics on the Same Die
Integrated Chemical Sensor
Embedded Wafer Level Package for 3D and Package-on-Package Applications, and Method of Manufacture
Through via Package
Resistor Thin Film Mtp Memory
Ball Grid Array to Pin Grid Array Conversion
Capacitance Trimming with an Integrated Heater
Embedded Wafer Level Package for 3D and Package-on-Package Applications, and Method of Manufacture
Offset of Contact Opening for Copper Pillars in Flip Chip Packages
Plasma Treatment on Semiconductor Wafers
Embedded Wafer Level Optical Package Structure and Manufacturing Method
Testing of Analog-to-Digital Converters
Methods and Apparatus for Tmah Etching
Heater design for heat-trimmed thin film resistors
Apparatus and Method for Placing Solder Balls
Top Gate Mold with Particle Trap
Adhesive Dam
System and Method for Reducing Input Current Spike for Drive Circuitry
Circuit Module with Multiple Submodules
Optical Sensor Package with Through Vias
Reducing Warpage for Fan-Out Wafer Level Packaging
Resistor Thin Film Mtp Memory
Resistor Thin Film Mtp Memory
Through via Package
Integrated Circuit Package and Method of Forming the Same
Wafer Level Packaging, Optical Detection Sensor and Method of Forming Same
Wafer Level Packaging, Optical Detection Sensor and Method of Forming Same
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 15, 2009
From: JIN, YONGGANG
To: ST MICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 022112/0796 →
Assignment of Assignor's Interest
Jul 21, 2009
From: LOO, KUM-WENG; LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)
Reel/Frame 022986/0140 →
Assignment of Assignor's Interest
Feb 22, 2010
From: HU, GUOJUN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 023971/0897 →
Assignment of Assignor's Interest
Feb 26, 2010
From: MIN, TANG; LE NEEL, OLIVIER; SHANKAR, RAVI
To: INSTITUTE OF MICROELECTRONICS; STMICROELECTONICS, ASIA PACIFIC PTE LTD.
Reel/Frame 023996/0639 →
Assignment of Assignor's Interest
Mar 8, 2010
From: GOH, KIM-YONG
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024046/0033 →
Assignment of Assignor's Interest
Mar 15, 2010
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 024082/0982 →
Assignment of Assignor's Interest
Mar 18, 2010
From: GOH, KIM-YONG
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024100/0643 →
Assignment of Assignor's Interest
Mar 18, 2010
From: MA, YIYI
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024100/0678 →
Assignment of Assignor's Interest
Apr 12, 2010
From: SHANKAR, RAVI; LE NEEL, OLIVIER
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 024217/0321 →
Assignment of Assignor's Interest
Sep 3, 2010
From: LE NEEL, OLIVIER; LEUNG, CALVIN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 024939/0838 →
Assignment of Assignor's Interest
Sep 28, 2010
From: WONG, WINGSHENQ; GANI, DAVID; DE LOS REYES, GLENN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 025055/0776 →
Assignment of Assignor's Interest
Sep 29, 2010
From: LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 025063/0361 →
Assignment of Assignor's Interest
Oct 25, 2010
From: JIN, YONGGANG
To: STMICROELECTRONICS PTE. LTD.
Reel/Frame 025188/0785 →
Assignment of Assignor's Interest
Nov 2, 2010
From: LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 025236/0948 →
Assignment of Assignor's Interest
Nov 9, 2010
From: LIM, TING FANG; NIU, CHENGYU; LE NEEL, OLIVER; LEUNG, CALVIN
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.; STMICROELECTRONICS, INC.
Reel/Frame 025339/0225 →
Assignment of Assignor's Interest
Dec 6, 2010
From: SHANKAR, RAVI; LE NEEL, OLIVIER
To: STMICROELECTRONICS PTE. LTD.
Reel/Frame 025458/0375 →
Assignment of Assignor's Interest
Dec 6, 2010
From: SHANKAR, RAVI; LE NEEL, OLIVIER
To: STMICROELECTRONICS PTE. LTD.
Reel/Frame 025458/0330 →
Corrective Assignment to Correct the Third Inventor's Name from Oliver Le Neel to Olivier Le Neel Previously Recorded on Reel 025339 Frame 0225. Assignor(S) Hereby Confirms the Assignment of the Entire Right, Title and Interest.
Feb 7, 2011
From: LIM, TING FANG; NIU, CHENGYU; LE NEEL, OLIVIER; LEUNG, CALVIN
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.; STMICROELECTRONICS, INC.
Reel/Frame 025756/0014 →
Assignment of Assignor's Interest
Aug 2, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS PTE LTD
Reel/Frame 026687/0283 →
Assignment of Assignor's Interest
Aug 2, 2011
From: LIM, TING FANG; LE NEEL, OLIVIER; LEUNG, CALVIN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026689/0965 →
Assignment of Assignor's Interest
Aug 2, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026689/0975 →
Assignment of Assignor's Interest
Aug 2, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026689/0950 →
Assignment of Assignor's Interest
Aug 2, 2011
From: LE NEEL, OLIVIER; LEUNG, CALVIN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026689/0919 →
Assignment of Assignor's Interest
Aug 2, 2011
From: NIU, CHENGYU
To: STMICROELECTRONICS, INC.
Reel/Frame 026689/0960 →
Assignment of Assignor's Interest
Aug 12, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026742/0671 →