IP Library › Assignment 024046/0033
Patent Assignment
Reel/Frame 024046/0033

Assignment of Assignor's Interest

Recorded: 2010-03-08 Pages: 3
Assignor
GOH, KIM-YONG
Executed: 2010-01-04
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Multi-Stacked Semiconductor Dice Scale Package Structure and Method of Manufacturing Same
Patent: 8,502,394 →
Application: 12/651,080 →
Publication: US 2011/0156230
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 29, 2011
From: GOH, KIM-YONG
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026821/0638 →
Assignment of Assignor's Interest Oct 21, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027098/0641 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →