Patent Assignment
Reel/Frame 026821/0638
Assignment of Assignor's Interest
Recorded: 2011-08-29
Pages: 3
Assignor
GOH, KIM-YONG
Executed: 2011-08-22
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Multi-Stacked Semiconductor Dice Scale Package Structure and Method of Manufacturing Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 8, 2010
From: GOH, KIM-YONG
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024046/0033 →
Assignment of Assignor's Interest
Oct 21, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027098/0641 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →