IP Library › Assignment 027098/0641
Patent Assignment
Reel/Frame 027098/0641

Assignment of Assignor's Interest

Recorded: 2011-10-21 Pages: 3
Assignor
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Multi-Stacked Semiconductor Dice Scale Package Structure and Method of Manufacturing Same
Patent: 8,502,394 →
Application: 12/651,080 →
Publication: US 2011/0156230
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 8, 2010
From: GOH, KIM-YONG
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024046/0033 →
Assignment of Assignor's Interest Aug 29, 2011
From: GOH, KIM-YONG
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026821/0638 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →