Patent Assignment
Reel/Frame 024100/0678
Assignment of Assignor's Interest
Recorded: 2010-03-18
Pages: 3
Assignor
MA, YIYI
Executed: 2010-01-04
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property
(1)
Thermally Enhanced Expanded Wafer Level Package Ball Grid Array Structure and Method of Making the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 2011
From: MA, YIYI
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026821/0851 →
Assignment of Assignor's Interest
Oct 21, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027102/0714 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →