Patent Assignment
Reel/Frame 026821/0851
Assignment of Assignor's Interest
Recorded: 2011-08-29
Pages: 3
Assignor
MA, YIYI
Executed: 2011-08-02
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Thermally Enhanced Expanded Wafer Level Package Ball Grid Array Structure and Method of Making the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 18, 2010
From: MA, YIYI
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024100/0678 →
Assignment of Assignor's Interest
Oct 21, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027102/0714 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →