IP Library › Assignment 027102/0714
Patent Assignment
Reel/Frame 027102/0714

Assignment of Assignor's Interest

Recorded: 2011-10-21 Pages: 3
Assignor
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Thermally Enhanced Expanded Wafer Level Package Ball Grid Array Structure and Method of Making the Same
Patent: 8,497,587 →
Application: 12/650,360 →
Publication: US 2011/0156236
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 18, 2010
From: MA, YIYI
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024100/0678 →
Assignment of Assignor's Interest Aug 29, 2011
From: MA, YIYI
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026821/0851 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →