Patent Assignment
Reel/Frame 026742/0671
Assignment of Assignor's Interest
Recorded: 2011-08-12
Pages: 4
Assignor
STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Executed: 2011-08-01
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
A Camera Module Including an Image Sensor and a Laterally Adjacent Surface Mount Device Coupled at a Lower Surface of a Dielectric Material Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2010
From: LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 025236/0948 →
Corrective Assignment to Correct the Assignee Previously Recorded on Reel 025236 Frame 0948. Assignor(S) Hereby Confirms the Stmicroelectronics Asia Pacific Pte Ltd. Should Be Stmicroelectronics Pte Ltd.
Nov 7, 2011
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 027188/0343 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →