IP Library › Assignment 024100/0643
Patent Assignment
Reel/Frame 024100/0643

Assignment of Assignor's Interest

Recorded: 2010-03-18 Pages: 3
Assignor
GOH, KIM-YONG
Executed: 2010-01-13
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Fan-Out Wafer Level Package with Polymeric Layer for High Reliability
Patent: 8,436,255 →
Application: 12/651,295 →
Publication: US 2011/0157853
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 24, 2011
From: GOH, KIM-YONG
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0530 →
Assignment of Assignor's Interest Oct 24, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0533 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →