IP Library › Assignment 027110/0530
Patent Assignment
Reel/Frame 027110/0530

Assignment of Assignor's Interest

Recorded: 2011-10-24 Pages: 3
Assignor
GOH, KIM-YONG
Executed: 2011-09-05
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Fan-Out Wafer Level Package with Polymeric Layer for High Reliability
Patent: 8,436,255 →
Application: 12/651,295 →
Publication: US 2011/0157853
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 18, 2010
From: GOH, KIM-YONG
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.
Reel/Frame 024100/0643 →
Assignment of Assignor's Interest Oct 24, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0533 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →