Patent Assignment
Reel/Frame 026689/0960
Assignment of Assignor's Interest
Recorded: 2011-08-02
Pages: 3
Assignor
NIU, CHENGYU
Executed: 2011-08-01
Assignee
STMICROELECTRONICS, INC.
MAIL STATION 2346, 750 CANYON DRIVE, SUITE 300, COPPELL, TEXAS, 75019
Covered Property
(1)
Via-Less Thin Film Resistor with a Dielectric Cap
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 9, 2010
From: LIM, TING FANG; NIU, CHENGYU; LE NEEL, OLIVER; LEUNG, CALVIN
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.; STMICROELECTRONICS, INC.
Reel/Frame 025339/0225 →
Corrective Assignment to Correct the Third Inventor's Name from Oliver Le Neel to Olivier Le Neel Previously Recorded on Reel 025339 Frame 0225. Assignor(S) Hereby Confirms the Assignment of the Entire Right, Title and Interest.
Feb 7, 2011
From: LIM, TING FANG; NIU, CHENGYU; LE NEEL, OLIVIER; LEUNG, CALVIN
To: STMICROELECTRONICS ASIA PACIFIC PTE, LTD.; STMICROELECTRONICS, INC.
Reel/Frame 025756/0014 →
Assignment of Assignor's Interest
Aug 2, 2011
From: LIM, TING FANG; LE NEEL, OLIVIER; LEUNG, CALVIN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026689/0965 →
Assignment of Assignor's Interest
Aug 2, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026689/0975 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0883 →