IP Library › Assignment 024082/0982
Patent Assignment
Reel/Frame 024082/0982

Assignment of Assignor's Interest

Recorded: 2010-03-15 Pages: 3
Assignors
GOH, KIM-YONG
Executed: 2010-01-28
LUAN, JING-EN
Executed: 2010-01-28
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Fan-Out Wafer Level Package for an Optical Sensor and Method of Manufacture Thereof
Patent: 8,466,997 →
Application: 12/651,304 →
Publication: US 2011/0157452
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 24, 2011
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0694 →
Assignment of Assignor's Interest Oct 24, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0697 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →