IP Library › Assignment 027110/0694
Patent Assignment
Reel/Frame 027110/0694

Assignment of Assignor's Interest

Recorded: 2011-10-24 Pages: 3
Assignors
GOH, KIM-YONG
Executed: 2011-08-31
LUAN, JING-EN
Executed: 2011-08-31
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Fan-Out Wafer Level Package for an Optical Sensor and Method of Manufacture Thereof
Patent: 8,466,997 →
Application: 12/651,304 →
Publication: US 2011/0157452
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 15, 2010
From: GOH, KIM-YONG; LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE. LTD.
Reel/Frame 024082/0982 →
Assignment of Assignor's Interest Oct 24, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0697 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →