Thin film metal-dielectric-metal transistor
View Patent ↗A transistor is formed having a thin film metal channel region. The transistor may be formed at the surface of a semiconductor substrate, an insulating substrate, or between dielectric layers above a substrate. A plurality of transistors each having a thin film metal channel region may be formed. Multiple arrays of such transistors can be vertically stacked in a same device.
1. A device comprising:
a first dielectric layer;
a thin film layer of chromium silicon on the first dielectric layer;
a source electrode coupled to the thin film layer of chromium silicon;
a drain electrode coupled to the thin film layer of chromium silicon, wherein the thin film layer of chromium silicon is positioned on a to surface of the source electrode d on a top surface of the drain electrode;
a gate electrode above the first dielectric; and
a gate dielectric between the thin film layer of chromium silicon and the gate electrode and overlying the thin film layer of chromium silicon, the source electrode, and the drain electrode.
2. The device of claim 1 wherein the thin film layer of chromium silicon contains boron atoms.
3. The device of claim 2 wherein the thin film layer of chromium silicon contains carbon atoms.
4. The device of claim 1 wherein the gate, source, and drain electrodes are formed of the same material.
5. A method comprising:
passing a current between a source electrode and a drain electrode through a thin film layer of chromium silicon overlying the source and drain electrodes; and
applying a first control voltage to a gate electrode to substantially stop the current, the gate electrode being separated from the thin film layer of chromium silicon by a gate dielectric, the gate dielectric overlying the source electrode, the drain electrode, and the thin film layer of chromium silicon.
6. The method of claim 5 wherein passing the current comprises applying a first bias voltage to a drain electrode.
7. The method of claim 6 wherein passing the current comprises applying a second bias voltage to a source electrode.
8. The method of claim 5 further comprising applying a second control voltage to the gate electrode to allow the current to pass through the thin film layer of chromium silicon.
9. The method of claim 5 wherein applying the first control voltage generates an electric field that alters the conductivity of the thin film layer of chromium silicon.
10. A method comprising:
forming a source electrode above a dielectric substrate;
forming a drain electrode above the dielectric substrate;
forming a thin film layer of chromium silicon above the dielectric substrate, on a top surface of the source electrode, and on a top surface of the drain electrode;
forming a gate electrode above the dielectric substrate; and
forming a gate dielectric between the thin film layer of chromium silicon and the gate electrode, the gate electrode being electrically insulated from the thin film layer of chromium silicon.
11. The method of claim 10 comprising applying a control voltage to the gate electrode to allow a current to pass from the drain electrode through the thin film layer of chromium silicon.
12. The method of claim 10 comprising applying a control voltage to the gate electrode to inhibit a current from passing from drain electrode through the thin film layer of chromium silicon.
13. The method of claim 10 forming the thin film layer of chromium silicon by physical vapor deposition.
14. The device of claim 10 comprising forming the gate dielectric above the source electrode and the drain electrode.