IP Library › Assignment 022112/0796
Patent Assignment
Reel/Frame 022112/0796

Assignment of Assignor's Interest

Recorded: 2009-01-15 Pages: 3
Assignor
JIN, YONGGANG
Executed: 2008-12-15
Assignee
ST MICROELECTRONICS ASIA PACIFIC PTE LTD.
28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Manufacturing Fan-Out Wafer Level Packaging
Patent: 8,119,454 →
Application: 12/330,044 →
Publication: US 2010/0140788
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 24, 2011
From: JIN, YONGGANG
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0670 →
Assignment of Assignor's Interest Oct 24, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 027110/0676 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →