IP Library › Assignment 022986/0140
Patent Assignment
Reel/Frame 022986/0140

Assignment of Assignor's Interest

Recorded: 2009-07-21 Pages: 5
Assignors
LOO, KUM-WENG
Executed: 2009-07-14
LUAN, JING-EN
Executed: 2009-07-21
Assignee
STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)
5A SERANGOON NORTH AVENUE 5, SINGAPORE, 554574, SINGAPORE
Covered Property (1)
Semiconductor Package with a Stiffening Member Supporting a Thermal Heat Spreader
Patent: 8,013,438 →
Application: 12/507,049 →
Publication: US 2011/0018125
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 2, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD
To: STMICROELECTRONICS PTE LTD
Reel/Frame 026687/0283 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →