IP Library › Assignment 026687/0283
Patent Assignment
Reel/Frame 026687/0283

Assignment of Assignor's Interest

Recorded: 2011-08-02 Pages: 3
Assignor
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO, INDUSTRIAL PARK 2, 569508, SINGAPORE
Covered Property (1)
Semiconductor Package with a Stiffening Member Supporting a Thermal Heat Spreader
Patent: 8,013,438 →
Application: 12/507,049 →
Publication: US 2011/0018125
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 21, 2009
From: LOO, KUM-WENG; LUAN, JING-EN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)
Reel/Frame 022986/0140 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →