IP Library › Assignment 026689/0919
Patent Assignment
Reel/Frame 026689/0919

Assignment of Assignor's Interest

Recorded: 2011-08-02 Pages: 3
Assignors
LE NEEL, OLIVIER
Executed: 2011-07-27
LEUNG, CALVIN
Executed: 2011-07-27
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property (1)
Multi-Layer via-Less Thin Film Resistor
Patent: 8,436,426 →
Application: 12/862,594 →
Publication: US 2012/0049324
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 3, 2010
From: LE NEEL, OLIVIER; LEUNG, CALVIN
To: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
Reel/Frame 024939/0838 →
Assignment of Assignor's Interest Aug 2, 2011
From: STMICROELECTRONICS ASIA PACIFIC PTE LTD.
To: STMICROELECTRONICS PTE LTD.
Reel/Frame 026689/0950 →
Assignment of Assignor's Interest Jul 18, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068433/0985 →