Patent Assignment
Reel/Frame 025576/0697
Assignment of Assignor's Interest
Recorded: 2011-01-04
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO,, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnection Structure of Three-Dimensional Semiconductor Device