Patent Assignment
Reel/Frame 025580/0030
Merger
Recorded: 2011-01-04
Received: 2011-01-04
Pages: 11
Assignor
BECK SEMICONDUCTOR LLC
Executed: 2010-12-07
Assignee
INTELLECTUAL VENTURES I LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DE, 19808, UNITED STATES
Covered Properties
(2)
Methods of Manufacturing Copper Interconnect Systems
Application:
12/554,137 →
Copper interconnect systems which use conductive, metal-based cap layers
Application:
60/455,496 →