IP Library Patent Application 60455496
Patent Application Provisional
App. No. 60/455,496 · Confirmation No. 4316

Copper interconnect systems which use conductive, metal-based cap layers

Provisional Application Expired
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Code Description Pages PDF
2007-05-11 APP.FILE.REC Filing Receipt 3 View
2005-11-16 CFILE Request for Corrected Filing Receipt 6 View
2003-05-27 TRNA Transmittal of New Application 1 View
2003-05-27 DRW Drawings-only black and white line drawings 3 View
2003-03-18 TRNA Transmittal of New Application 1 View
2003-03-18 SPEC Specification 11 View
2003-03-18 CLM Claims 6 View
2003-03-18 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
App. No.
60/455,496
Filed
2003-03-18