Patent Assignment
Reel/Frame 025583/0852
Assignment of Assignor's Interest
Recorded: 2011-01-05
Pages: 6
Assignors
GRAF, RICHARD S.
Executed: 2010-12-16
OKAMOTO, KEISHI
Executed: 2010-12-17
PAKBAZ, FARAYDON
Executed: 2010-12-17
SMITH, JACK R.
Executed: 2010-12-15
VENTRONE, SEBASTIAN T.
Executed: 2010-12-15
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD RD., ARMONK, NEW YORK, 10504
Covered Property
(1)
Integrated Circuit Chip Incorporating Embedded Thermal Radiators for Localized, on-Demand, Heating and a System and Method for Designing Such an Integrated Circuit Chip
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →