Patent Assignment
Reel/Frame 025591/0615
Assignment of Assignor's Interest
Recorded: 2010-12-16
Pages: 5
Assignors
HABA, BELGACEM
Executed: 2010-12-03
ZOHNI, WAEL
Executed: 2010-12-03
CRISP, RICHARD DEWITT
Executed: 2010-12-03
Assignee
TESSERA RESEARCH LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Enhanced Stacked Microelectronic Assemblies with Central Contacts and Improved Thermal Characteristics
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 14, 2011
From: TESSERA RESEARCH LLC
To: TESSERA, INC.
Reel/Frame 026916/0054 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →