Patent Assignment
Reel/Frame 026916/0054
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2011-09-14
Received: 2011-09-14
Pages: 7
Assignor
TESSERA RESEARCH LLC
Executed: 2011-09-08
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Applications
(47)
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE
App. No. 13/196,192
→
MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES
App. No. 13/092,376
→
VIAS IN POROUS SUBSTRATES
App. No. 13/092,495
→
STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR
App. No. 61/477,820
→
INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC
App. No. 13/091,800
→
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
App. No. 13/080,876
→
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
App. No. 13/076,969
→
STACKED MICROELECTRONIC ASSEMBY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP
App. No. 13/051,424
→
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS
App. No. 13/051,414
→
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT
App. No. 12/986,556
→
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT
App. No. 12/986,601
→
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
App. No. 61/424,906
→
PIN ATTACHMENT
App. No. 12/966,225
→
INTERCONNECT STRUCTURE
App. No. 12/965,192
→
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
App. No. 12/964,049
→
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
App. No. 12/963,938
→
COMPLIANT INTERCONNECTS IN WAFERS
App. No. 12/962,806
→
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS
App. No. 61/419,037
→
STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS
App. No. 12/958,866
→
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP
App. No. 61/419,033
→
LEAD STRUCTURES WITH VERTICAL OFFSETS
App. No. 61/416,779
→
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND VIAS CONNECTED TO THE CENTRAL CONTACTS
App. No. 12/953,994
→
FLOW UNDERFILL FOR MICROELECTRONIC PACKAGE
App. No. 12/938,068
→
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS
App. No. 12/907,522
→
STAGED VIA FORMATION FROM BOTH SIDES OF CHIP
App. No. 12/884,649
→
MULTI-FUNCTION AND SHIELDED 3D INTERCONNECTS
App. No. 12/884,695
→
METAL CAN IMPEDANCE CONTROL STRUCTURE
App. No. 12/883,811
→
TSOP WITH IMPEDANCE CONTROL
App. No. 12/883,556
→
CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING
App. No. 12/883,421
→
STACKED CHIP ASSEMBLY HAVING VERTICAL VIAS
App. No. 12/883,431
→
IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL
App. No. 12/883,821
→
MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING
App. No. 12/844,463
→
ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN
App. No. 12/842,692
→
NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS
App. No. 12/842,669
→
MICROELECTRONIC ELEMENTS HAVING METALLIC PADS OVERLYING VIAS
App. No. 12/842,717
→
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
App. No. 12/842,587
→
METHODS OF FORMING SEMICONDUCTOR ELEMENTS USING MICRO-ABRASIVE PARTICLE STREAM
App. No. 12/842,612
→
MICROELECTRONIC ELEMENTS WITH REAR CONTACTS CONNECTED WITH VIA FIRST OR VIA MIDDLE STRUCTURES
App. No. 12/842,651
→
STACKABLE MOLDED MICROELECTRONIC PACKAGES WITH AREA ARRAY UNIT CONNECTORS
App. No. 12/839,038
→
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE
App. No. 12/793,824
→
MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE
App. No. 61/322,404
→
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT
App. No. 12/722,784
→
MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND REFERENCE WIREBOND
App. No. 12/722,799
→
MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE
App. No. 12/644,476
→
WAFER LEVEL EDGE STACKING
App. No. 12/456,349
→
Curable resins and articles made therefrom
App. No. 61/268,488
→
Impedance controlled wirebond
App. No. 61/210,063
→