IP Library › Patent Application 61419037
Patent Application Provisional
App. No. 61/419,037 · Confirmation No. 3895

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2010-12-28 APP.FILE.REC Filing Receipt 3 View
2010-12-09 IMIS Miscellaneous Internal Document 50 View
2010-12-02 ADS Application Data Sheet 5 View
2010-12-02 SPEC Specification 34 View
2010-12-02 ABST Abstract 1 View
2010-12-02 DRW Drawings-only black and white line drawings 8 View
2010-12-02 TR.PROV Provisional Cover Sheet (SB16) 4 View
2010-12-02 TR.PROV Provisional Cover Sheet (SB16) 1 View
2010-12-02 WFEE Fee Worksheet (SB06) 2 View
2010-12-02 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
61/419,037
Filed
2010-12-02