Stacked microelectronic assembly with TSVS formed in stages with plural active chips
A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.
1. A microelectronic assembly, comprising:
a first microelectronic element having a front surface and a first electrically conductive pad exposed at the front surface, and a first electrically conductive element extending along the front surface away therefrom;
a second microelectronic element having a front surface facing the front surface of the first microelectronic element, and a second electrically conductive pad exposed at the front surface and juxtaposed with a portion of the first electrically conductive element, the first and second microelectronic elements embodying active semiconductor devices;
a second electrically conductive element extending within an opening extending from a rear surface of the first microelectronic element towards the front surface thereof, the second electrically conductive element contacting the first electrically conductive pad; and
a third electrically conductive element extending within an opening extending from a rear surface of the second microelectronic element towards the front surface thereof, the third conductive element extending through an opening in the second conductive pad and contacting the second electrically conductive pad and the first electrically conductive element, the first electrically conductive element extending in a lateral direction along the front surface of the first microelectronic component from the first electrically conductive pad toward the third electrically conductive element.
2. The microelectronic assembly as claimed in claim 1 , wherein the opening in the first microelectronic element includes a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, and a second opening extending from the first opening towards the front surface of the first microelectronic element, wherein interior surfaces of the first and second openings extend in first and second directions relative to the front surface, respectively, to define a substantial angle, the second electrically conductive element contacting the first electrically conductive pad and electrically connecting the second electrically conductive pad.
3. The microelectronic assembly as claimed in claim 1 , wherein the opening in the second microelectronic element includes a first opening extending from a rear surface of the second microelectronic element towards the front surface thereof, and a second opening extending from the first opening towards the front surface of the second microelectronic element, wherein interior surfaces of the first and second openings extend in first and second directions relative to the front surface, respectively, to define a substantial angle, the second electrically conductive element contacting the first electrically conductive pad and electrically connecting the second electrically conductive pad.
4. The microelectronic assembly as claimed in claim 1 , wherein the second and third electrically conductive elements are spaced apart from one another in a direction along the front surfaces of the first and second microelectronic elements.
5. The microelectronic assembly as claimed in claim 1 , wherein the first electrically conductive element has an upper surface exposed on an adhesive on the front surface of the second microelectronic element and the second electrically conductive element contacts at least a portion of the upper surface.
6. The microelectronic assembly as claimed in claim 1 , wherein at least a portion of the first conductive element is an electrically conductive trace.
7. The microelectronic assembly as claimed in claim 1 , further comprising a third microelectronic element having a front surface facing the rear surface of the second microelectronic element, and a fourth electrically conductive element extending within an opening extending from the rear surface of the third microelectronic element, the third electrically conductive element extending through an electrically conductive pad of the fourth microelectronic element and contacting the third electrically conductive element.
8. The microelectronic assembly as claimed in claim 7 , further comprising one or more fourth microelectronic elements each stacked to overlie the rear surface of the third microelectronic element and being electrically coupled with the third conductive element thereof, each fourth microelectronic element having a front surface facing the rear surface of the third or fourth microelectronic element adjacent thereto, and having a fifth electrically conductive element extending within at least an opening extending from the rear surface of the fourth microelectronic element and extending through the electrically conductive pad of the fourth microelectronic element and contacting the respective electrically conductive element extending through the microelectronic element adjacent thereto.
9. A system comprising a microelectronic assembly as claimed in claim 1 and one or more other electronic components electrically connected to the microelectronic assembly.
10. The system as claimed in claim 9 , further comprising a housing, said microelectronic assembly and said other electronic components being mounted to said housing.