Stacked microelectronic assembly with TSVs formed in stages with plural active chips
View Patent ↗A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.
1. A microelectronic assembly, comprising:
a first microelectronic element having a front surface and a first electrically conductive pad exposed at the front surface;
a second microelectronic element having a front surface and a second electrically conductive pad exposed thereat, the front surfaces of the first and second microelectronic elements facing one another, and the first and second pads being juxtaposed, each of the microelectronic elements embodying active semiconductor devices;
a first electrically conductive element extending within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof and within a second opening extending from the first opening through the first pad, the first electrically conductive element contacting the first pad and contacting a first surface of the second pad; and
a second electrically conductive element extending within a third opening extending from a rear surface of the second microelectronic element toward the front surface thereof, the second electrically conductive element contacting a second surface of the second pad opposite from the first surface,
wherein the first electrically conductive element forms a continuous monolithic metal region extending between the rear surface of the first microelectronic element and the first surface of the second pad.
2. A microelectronic assembly as claimed in claim 1 , wherein the first electrically conductive element extends between the first surface of the second pad and a surface of the first pad juxtaposed with the first surface of the second pad.
3. The microelectronic assembly as claimed in claim 1 , wherein the first electrically conductive element conforms to a contour of at least a portion of the interior surface of the first opening.
4. The microelectronic assembly as claimed in claim 1 , wherein the first electrically conductive element does not conform to a contour of at least a portion of the interior surface of the first opening.
5. The microelectronic assembly as claimed in claim 1 , wherein the second electrically conductive element conforms to a contour of at least a portion of an interior surface the third opening.
6. The microelectronic assembly as claimed in claim 1 , wherein the second electrically conductive element does not conform to a contour of at least a portion of the interior surface of the third opening.
7. The microelectronic assembly as claimed in claim 1 , wherein the first opening in the first microelectronic element and the third opening in the second microelectronic element are tapered, becoming smaller in opposite directions from one another.
8. The microelectronic assembly as claimed in claim 1 , wherein the first opening includes a fourth opening extending from the rear surface of the first microelectronic element towards the front surface thereof and a fifth opening extending from the fourth opening in a direction towards the front surface of the first microelectronic element, wherein interior surfaces of the fourth and fifth openings extend in first and second directions relative to the front surface, respectively, to define a substantial angle.
9. A microelectronic assembly, comprising:
a first microelectronic element having a front surface and a first electrically conductive pad exposed at the front surface;
a second microelectronic element having a front surface facing the front surface of the first microelectronic element and a second electrically conductive pad exposed at the front surface and juxtaposed with the first conductive pad, each of the microelectronic elements embodying active semiconductor devices; and
an electrically conductive element extending within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from a rear surface of the second microelectronic element towards the front surface thereof, and within a third opening extending from the first opening to the second opening through the first and second pads, wherein the first and second openings are each tapered, becoming smaller in opposite directions from one another, the electrically conductive element contacting the first and second pads, and
wherein the electrically conductive element forms a continuous monolithic metal region extending between the rear surface of the first microelectronic element and the rear surface of the second microelectronic element.
10. A system comprising a structure according to claim 1 and one or more other electronic components electrically connected to the structure.
11. A system as claimed in claim 10 further comprising a housing, said structure and said other electronic components being mounted to said housing.