IP Library › Patent Application 61419033
Patent Application Provisional
App. No. 61/419,033 · Confirmation No. 3866

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2010-12-27 APP.FILE.REC Filing Receipt 3 View
2010-12-09 IMIS Miscellaneous Internal Document 81 View
2010-12-02 ADS Application Data Sheet 4 View
2010-12-02 DRW Drawings-only black and white line drawings 26 View
2010-12-02 SPEC Specification 47 View
2010-12-02 ABST Abstract 1 View
2010-12-02 TR.PROV Provisional Cover Sheet (SB16) 3 View
2010-12-02 TR.PROV Provisional Cover Sheet (SB16) 1 View
2010-12-02 WFEE Fee Worksheet (SB06) 2 View
2010-12-02 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
61/419,033
Filed
2010-12-02