Patent Assignment
Reel/Frame 025607/0108
Assignment of Assignor's Interest
Recorded: 2011-01-10
Received: 2011-01-10
Pages: 6
Assignors
BACHMAN, MARK A.
Executed: 2010-12-15
OSENBACH, JOHN
Executed: 2010-12-15
MERCHANT, SAILESH M.
Executed: 2011-01-10
Assignee
LSI CORPORATION
1621 BARBER LANE, MS D-106, MILPITAS, CA, 95035, UNITED STATES
Covered Property
(1)
Integration of Shallow Trench Isolation and Through-Substrate Vias into Integrated Circuit Designs
Application:
12/969,852 →