Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
View Patent ↗A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously.
1. An integrated circuit, comprising:
a substrate having a first side and a second opposite side;
a shallow trench isolation structure, wherein one end of the shallow trench isolation structure is buried inside the substrate and an opposite end of the shallow trench isolation structure is located at a surface of the first side of the substrate; and
a through-substrate via, wherein one end of the through-substrate via is located at the surface of the first side of the substrate and an opposite end of the through-substrate via is located at a surface of the second side of the substrate wherein,
a same insulating layer is located within an opening defining the shallow trench isolation structure and within an opening defining the through-substrate via, wherein the same insulating layer includes a passivation layer and a diffusion barrier layer on sidewalls of the opening defining the shallow trench isolation structure and on sidewalls of the opening defining the through-substrate via.
2. The integrated circuit of claim 1 , wherein the same insulating layer includes the passivation layer of silicon oxide and the diffusion barrier layer of silicon nitride on the sidewalls of the opening defining the shallow trench isolation structure and on the sidewalls of the opening defining the through-substrate via.
3. The integrated circuit of claim 1 , wherein the shallow trench isolation structure is located between the through-substrate via and a passive or active electrical component located on the first side of the substrate.
4. The integrated circuit of claim 1 , wherein the shallow trench isolation structure is located between a first passive or active electrical component located on the first side of the substrate and a second passive or active electrical component located on the first side of the substrate.
5. The integrated circuit of claim 1 , further including an electrically conductive layer located on the first side of the substrate and covering the through-substrate via opening on the first side.
6. The integrated circuit of claim 1 , further including metal lines and interlayer dielectric layers on the first side of the substrate wherein at least one of the metal lines electrically connects a passive or active electrical component located on the first side of the substrate to an electrically conductive layer covering the through-substrate via.
7. The integrated circuit of claim 1 , wherein the substrate is interconnected to one or more other substrates by the through-substrate via.
8. The integrated circuit of claim 7 , wherein the substrate and the one or more other substrates are part of a three-dimensional integrated circuit package.
9. The integrated circuit of claim 1 , wherein the diffusion barrier layer is on the passivation layer on the sidewalls of the opening defining the shallow trench isolation structure and on the sidewalls of the opening defining the through-substrate via.