Patent Assignment
Reel/Frame 025609/0285
Assignment of Assignor's Interest
Recorded: 2011-01-10
Pages: 4
Assignor
ARAI, TADASHI
Executed: 2011-01-06
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate, Method for Manufacturing Wiring Substrate, and Semiconductor Package Including Wiring Substrate