Patent Assignment
Reel/Frame 025612/0792
Assignment of Assignor's Interest
Recorded: 2011-01-06
Pages: 6
Assignors
TEZCAN, DENIZ SABUNCOUGLU
Executed: 2010-12-02
CIVALE, YANN
Executed: 2010-12-02
SWINNEN, BART
Executed: 2010-12-02
BEYNE, ERIC
Executed: 2010-12-02
Assignee
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Fabricating Through-Substrate Vias