Patent Assignment
Reel/Frame 025618/0665
Assignment of Assignor's Interest
Recorded: 2011-01-11
Pages: 4
Assignors
YANG, CHING-JUNG
Executed: 2011-01-11
LIU, YU-WEN
Executed: 2011-01-11
TONG, MICHAEL SHOU-MING
Executed: 2011-01-11
CHEN, HSIEN-WEI
Executed: 2011-01-11
YANG, CHUNG-YING
Executed: 2011-01-11
YU, TSUNG-YUAN
Executed: 2011-01-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Seal Ring Structure for Integrated Circuit Chips