Patent Assignment
Reel/Frame 025623/0776
Assignment of Assignor's Interest
Recorded: 2011-01-12
Pages: 4
Assignors
WANG, DAVID WEI
Executed: 2010-12-09
LIU, AN-HONG
Executed: 2010-12-08
HUANG, HSIANG-MING
Executed: 2010-12-08
YANG, JAR-DAR
Executed: 2010-12-08
LEE, YI-CHANG
Executed: 2010-12-08
Assignee
CHIPMOS TECHNOLOGIES INC.
NO.1, R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Property
(1)
Multi-Chip Stack Package Structure