Patent Assignment
Reel/Frame 025627/0409
Assignment of Assignor's Interest
Recorded: 2011-01-12
Pages: 5
Assignee
STMICROELECTRONICS (R&D) LTD
PLANAR HOUSE, PARKWAY, GLOBE PARK, MARLOW, BUCKS, SL7 1YL, UNITED KINGDOM
Covered Property
(1)
Integrated Circuit Package with Multiple Dies and Bundling of Control Signals