Patent Assignment
Reel/Frame 025627/0770
Assignment of Assignor's Interest
Recorded: 2011-01-12
Pages: 3
Assignor
MARVELL SEMICONDUCTOR, INC.
Executed: 2011-01-06
Assignee
MARVELL INTERNATIONAL LTD.
ARGYLE HOUSE, 41A CEDAR AVENUE, HAMILTON, HM12, BERMUDA
Covered Property
(1)
Method of Stacking Flip-Chip on Wire-Bonded Chip
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 12, 2011
From: LIOU, SHIANN-MING; WU, ALBERT
To: MARVELL SEMICONDUCTOR, INC.
Reel/Frame 025627/0754 →
Assignment of Assignor's Interest
Jan 12, 2011
From: MARVELL INTERNATIONAL, LTD.
To: MARVELL WORLD TRADE LTD.
Reel/Frame 025627/0783 →
License
Jan 12, 2011
From: MARVELL WORLD TRADE LTD.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 025627/0793 →
Assignment of Assignor's Interest
Jan 29, 2020
From: MARVELL WORLD TRADE LTD.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 051778/0537 →
Assignment of Assignor's Interest
Feb 20, 2020
From: MARVELL INTERNATIONAL LTD.
To: CAVIUM INTERNATIONAL
Reel/Frame 052918/0001 →
Assignment of Assignor's Interest
Jun 16, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053475/0001 →