Patent Assignment
Reel/Frame 025657/0384
Assignment of Assignor's Interest
Recorded: 2011-01-19
Pages: 3
Assignor
CHIU, TZU-WEI
Executed: 2010-10-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Seal Ring Structure with Polyimide Layer Adhesion