Assignment of Assignor's Interest

Recorded: 2011-01-19 Pages: 2

Assignor

KANEKO, YUICHI

Executed: 2010-11-25

Assignee

OKI SEMICONDUCTOR CO., LTD.

550-1, HIGASHIASAKAWA-CHO, HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN

Covered Property (1)

Method of Manufacturing a Semiconductor Device and Substrate Carrier Structure

Patent: 8,216,919 →

Application: 13/009,673 →

Publication: US 2011/0183496

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.