Patent Assignment
Reel/Frame 025666/0731
Assignment of Assignor's Interest
Recorded: 2011-01-20
Pages: 5
Assignors
HORIUCHI, MICHIO
Executed: 2011-01-19
TOKUTAKE, YASUE
Executed: 2011-01-19
MATSUDA, YUICHI
Executed: 2011-01-19
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Wiring Substrate and Semiconductor Apparatus Including the Wiring Substrate