Patent Assignment
Reel/Frame 025690/0834
Assignment of Assignor's Interest
Recorded: 2011-01-25
Pages: 4
Assignors
TU, HSIU-WEN
Executed: 2010-12-27
HSIN, CHUNG-HSIEN
Executed: 2010-12-27
CHEN, HAN-HSING
Executed: 2010-12-27
CHEN, MING-HUI
Executed: 2010-12-27
KUO, REN-LONG
Executed: 2010-12-27
HSU, CHIH-CHENG
Executed: 2010-12-27
SHIAO, YOUNG-HOUNG
Executed: 2010-12-27
CHEN, TSAO-PIN
Executed: 2010-12-27
Assignee
KINGPAK TECHNOLOGY INC.
NO. 84, TAI-HO RD., CHU-PEI, HSIN-CHU HSIEN, 30267, TAIWAN
Covered Property
(1)
Wafer Level Image Sensor Packaging Structure and Manufacturing Method of the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.