Patent Assignment
Reel/Frame 025703/0200
Assignment of Assignor's Interest
Recorded: 2011-01-26
Pages: 3
Assignors
STUPAR, PHILIP A.
Executed: 2011-01-24
DENATALE, JEFFREY F.
Executed: 2011-01-24
BORWICK, ROBERT L., III
Executed: 2011-01-24
PAPAVASILIOU, ALEXANDROS
Executed: 2011-01-24
Assignee
TELEDYNE SCIENTIFIC & IMAGING, LLC
P.O. BOX 1085, MAIL CODE A15, THOUSAND OAKS, CALIFORNIA, 91358-0085
Covered Property
(1)
Through-Substrate Vias with Polymer Fill and Method of Fabricating Same